SLA – Tough 2000 Resin

Tough 2000 Resin is a 3D printing material designed for Stereolithography (SLA) technology. It is a high-performance engineering material designed for parts that require strength, stiffness, and long-term durability. With mechanical properties comparable to ABS, it delivers excellent impact resistance, improved temperature performance, and a refined matte finish for production-ready components.

Key Material Facts:

• For prototyping strong and sturdy parts that should not bend easily, as well as jigs and fixtures requiring minimal deflection.
• Tough 2000 Resin has similar strength and stiffness to ABS plastics, making it ideal for functional parts that are difficult to bend and will hold up with extended use.
• Material is very transparent to RF (radio frequency) and works well for antenna structures
• High Detail for demanding applications, capture the finest of features
• Parts can be printed solid and air / fluid tight right off the printer, no sealing required
• Strong and Precise parts that create accurate and robust parts, ideal for
  rapid prototyping, functional testing and product development.
• Compatible with assembly features including:
  • Glue Joints / light welding
  • Printed In Threads (However Helicoils are recommended)

Common Applications:

• Jig and fixture for use as manufacturing aids
• Antenna structures
• Enclosures
• Motor mounts

Material Reference Data:

• For more information on how the SLA printing process works please check out this page.
• For SLA part design trick and tips check out this page.
• Material manufacturers website

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SLA – Tough 2000 Resin V2: Technical specifications

Mechanical Properties – Post-cured for 120 minutes at 80 °C.

Property Description	Measurement (Metric)	Measurement (English)
Ultimate Tensile Strength (MPa | PSI)	40.4 MPa	5802 psi
Tensile Modulus (GPa | KSI)	1800 MPa	261 ksi
Elongation at Break	79%	79%
Flexural Strength (MPa | PSI)	67 MPa	99718 psi
Flexural Modulus (MPa | KSI)	1701 MPa	247 ksi
Notched Izod (J/m | ft-lbf/in)	25 J/m	0.47 ft-lb/in
Unnotched Izod (J/m | ft-lbf/in)	325 J/m	6.09 ft-lb/in
Heat Deflection Temperature – Post-Cured 5 min (Ambient)	70 °C @ 0.45 MPa (66 PSI) 57 °C @ 1.82 MPa (264 PSI)	158 °F @ 0.45 MPa (66 PSI) 135 °F @ 1.82 MPa (264 PSI)
Thermal Expansion (0-150°C)	134.2 μm/m/°C	74.6 μin/in/°F
Dielectric Strength	15.5 kV/mm	–
Dielectric Constant (50 Hz)	3.46	–
Dielectric Constant (1 kHz)	3.38	–
Dissipation Factor (50 Hz)	0.018	–
Dissipation Factor (1 kHz)	0.012	–
Volume Resistivity	3 * 1015 Ω-cm	–
Shore D Hardness	76D	–

SLA – Tough 2000 Resin Solvent Compatibility

Percent weight gain over 24 hours for a printed and post-cured 1 x 1 x 1 cm cube immersed in respective solvent

Solvent	24 hr weight gain, %
Acetic Acid 5%	0.17
Acetone	22.92
Bleach ~5% NaOCl	0.11
Butyl Acetate	18.65
Diesel Fuel	0.08
Diethyl glycol Monomethyl Ether	4.65
Hydraulic Oil	0.06
Hydrogen peroxide (3%)	0.21
Isooctane (aka gasoline)	21.24
Isopropyl Alcohol	4.21
Mineral oil (Light)	0.12
Mineral oil (Heavy)	0.07
Salt Water (3.5% NaCl)	0.16
Skydrol 5	0.96
Sodium Hydroxide solution (0.025% PH=10)	0.18
Strong Acid (HCl conc)	1.96
Water	0.19
Xylene	27.69
TPM	1.86

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SLA – Tough 2000 Resin: Part Gallery

Full Rocket Testing Video can be found here.