SLA – Tough 2000 Resin
Tough 2000 Resin is a 3D printing material designed for Stereolithography (SLA) technology, optimized for high strength, stiffness, and impact resistance. It is part of the “Tough” series of resins, known for simulating the mechanical properties of engineering plastics, such as ABS.
Key Material Facts:
- For prototyping strong and sturdy parts that should not bend easily, as well as jigs and fixtures requiring minimal deflection.
- Tough 2000 Resin has similar strength and stiffness to ABS plastics, making it ideal for functional parts that are difficult to bend and will hold up with extended use.
- Material is very transparent to RF (radio frequency) and works well for antenna structures
- High Detail for demanding applications, capture the finest of features
- Parts can be printed solid and air / fluid tight right off the printer, no sealing required
- Strong and Precise parts that create accurate and robust parts, ideal for
rapid prototyping, functional testing and product development. - Compatible with assembly features including:
- Glue Joints / light welding
- Printed In Threads (However Helicoils are recommended)
Common Applications:
- Jig and fixture for use as manufacturing aids
- Antenna structures
- Enclosures
- Motor mounts
Material Reference Data:
- For more information on how the SLA printing process works please check out this page.
- For SLA part design trick and tips check out this page.
- Material manufacturers website
SLA – Tough 2000 Resin: Technical specifications
Mechanical Properties – Post-cured for 120 minutes at 80 °C.
| Property Description | Measurement (Metric) | Measurement (English) |
| Ultimate Tensile Strength (MPa | PSI) | 46 | 6671 |
| Tensile Modulus (GPa | KSI) | 2.2 | 329 |
| Elongation at Break | 48% | 48% |
| Flexural Strength (MPa | PSI) | 65 | 9427 |
| Flexural Modulus (GPa | KSI) | 1.9 | 275 |
| Notched Izod (J/m | ft-lbf/in) | 40 | .75 |
| Unnotched Izod (J/m | ft-lbf/in) | 715 | 13 |
| Heat Deflection Temperature – Post-Cured 5 min (Ambient) | 63 °C @ 0.45 MPa (66 PSI) 53 °C @ 1.82 MPa (264 PSI) | 145 °F @ 0.45 MPa (66 PSI) 127 °F @ 1.82 MPa (264 PSI) |
| Thermal Expansion (0-150°C) | 91 μm/m/°C | 50 μin/in/°F |
SLA – Tough 2000 Resin Solvent Compatibility
Percent weight gain over 24 hours for a printed and post-cured 1 x 1 x 1 cm cube immersed in respective solvent
| Solvent | 24 hr weight gain, % |
| Acetic Acid 5% | 0.7 |
| Acetone | 18.8 |
| Bleach ~5% NaOCl | 0.6 |
| Butyl Acetate | 6.2 |
| Diesel Fuel | 0.1 |
| Diethyl glycol Monomethyl Ether | 5.3 |
| Hydraulic Oil | < 0.1 |
| Hydrogen peroxide (3%) | 0.6 |
| Isooctane (aka gasoline) | < 0.1 |
| Isopropyl Alcohol | 3.7 |
| Mineral oil (Light) | 0.1 |
| Mineral oil (Heavy) | 0.2 |
| Salt Water (3.5% NaCl) | 0.6 |
| Skydrol 5 | 0.9 |
| Sodium Hydroxide solution (0.025% PH 10) | 0.6 |
| Strong Acid (HCl conc) | 3.0 |
| Water | 0.6 |
| Xylene | 4.1 |
SLA – Tough 2000 Resin: Part Gallery
