SLA – ESD Resin
ESD (Electrostatic Discharge) resin is a specialized type of 3D printing material designed to safely dissipate static electricity, preventing damage to sensitive electronic components. This resin is commonly used in industries where electrostatic discharge could damage electronic devices or components during manufacturing, assembly, or usage.
Key Material Facts:
- Use ESD Resin to reduce risk and increase the yield on your manufacturing line by 3D printing custom tools, jigs, and fixtures for automotive, aerospace, electronics manufacturing.
- Static-Dissipative – Protect your critical electronics from unregulated static discharge to prevent component failures.
- High Toughness – With its high modulus and impact strength, ESD Resin is made to withstand operation on the production line.
- High Detail for demanding applications, capture the finest of features
- Parts can be printed solid and air / fluid tight right off the printer, no sealing required
- Compatible with assembly features including:
- Glue Joints / light welding
- Printed In Threads (However Helicoils are recommended)
Common Applications:
- Tooling & fixturing for electronics manufacturing
- Custom trays for component handling and storage
- Anti-static prototype and end-use components
Material Reference Data:
- For more information on how the SLA printing process works please check out this page.
- For SLA part design trick and tips check out this page.
- Material manufacturers website
SLA – ESD Resin: Technical specifications
Mechanical Properties – Post-cured for 60 minutes at 70 °C.
| Property Description | Measurement (Metric) | Measurement (English) |
| Ultimate Tensile Strength (MPa | PSI) | 44.2 | 6410 |
| Tensile Modulus (GPa | KSI) | 1.937 | 280.9 |
| Elongation at Break | 12% | 12% |
| Flexural Strength (MPa | PSI) | 61 | 8860 |
| Flexural Modulus (GPa | KSI) | 1.841 | 267 |
| Notched Izod (J/m | ft-lbf/in) | 26 | 0.489 |
| Unnotched Izod (J/m | ft-lbf/in) | 277 | 15.19 |
| Heat Deflection Temperature | 62.2 °C @ 0.45 MPa 54.2 °C @ 1.82 MPa | 143.9 °F @ 66 PSI 129.6 °F @ 264 PSI |
| Thermal Expansion (0-150°C) | 123.7 μm/m/°C | 68.7 μin/in/°F |
| Surface Resistivity | 105 – 108 Ω/sq | 105 – 108 Ω/sq |
| Volume Resistivity | 105 – 107 Ω-cm | 105 – 107 Ω-cm |
SLA – ESD Resin Solvent Compatibility
Percent weight gain over 24 hours for a printed and post-cured 1 x 1 x 1 cm cube immersed in respective solvent
| Solvent | 24 hr weight gain, % |
| Acetic Acid 5% | 0.5 |
| Acetone | 13.1 |
| Bleach ~5% NaOCl | 0.5 |
| Butyl Acetate | 3.8 |
| Diesel Fuel | 0.2 |
| Diethyl glycol Monomethyl Ether | 3.6 |
| Hydraulic Oil | 0.2 |
| Hydrogen peroxide (3%) | 0.6 |
| Isooctane (aka gasoline) | < 0.1 |
| Isopropyl Alcohol | 2.6 |
| Mineral oil (Light) | 0.1 |
| Mineral oil (Heavy) | 0.1 |
| Salt Water (3.5% NaCl) | 0.6 |
| Skydrol 5 | 0.5 |
| Sodium Hydroxide solution (0.025% PH 10) | 0.7 |
| Strong Acid (HCl conc) | 1.4 |
| Water | 0.7 |
| Xylene | 1.60 |
| TPM | 0.6 |
SLA – ESD Resin: Part Gallery
