SLA Material – ESD Resin

ESD Resin For Electronics Manufacturing.

Reduce risk and increase manufacturing yield by 3D printing custom tools, jigs, and fixtures with ESD Resin that protect your critical electronics components from static discharge. ESD Resin is a cost-effective solution for producing static-dissipative parts designed to endure use on the factory floor.

Common Applications:

Anti-static prototypes and end-use parts
Housings for sensitive electronics
Low quantity production of small parts.
Tooling, jigs, and fixtures for electronics manufacturing

SLA: ESD Technical Specifications:


MATERIAL PROPERTIES DATA
	Metric	ENGLISH	METHOD
Tensile Properties
Ultimate Tensile Strength	44.2 MPa	6410 psi	ASTM D 638-14
Tensile Modulus	1.937 GPa	280.9 ksi	ASTM D 638-14
Elongation at Break	12%	12%	ASTM D 638-14
Flexural Properties
Flexural Modulus	1.841 GPa	267 ksi	ASTM D 790-17
Impact Properties
Notched Izod	26 J/m	0.489 ft-lbs/in	ASTM D 256-10
Thermal Properties
Heat Deflection Temp. @ 1.8 MPa	54.2 °C	129.6 °F	ASTM D 648-18
Heat Deflection Temp. @ 0.45 MPa	62.2 °C	143.9 °F	ASTM D 648-18
Electrical Properties
Surface Resistivity	105 - 108 Ω/sq	105 - 108 Ω/sq	ANSI/ESD 11.11 3
Volume Resistivity	105 - 107 Ω-cm	105 - 107 Ω-cm	ANSI/ESD 11.11 3

SLA: ESD Solvent Compatibility:


SOLVENT COMPATIBILITY DATA
Percent weight gain over 24 hours for a printed and post-cured 1 x 1 x 1 cm cube immersed in respective solvent
Solvent	24 hr weight gain, %
Acetic Acid 5%	0.5
Acetone	13.1
Bleach ~5% NaOCl	0.5
Butyl Acetate	3.8
Diesel Fuel	0.2
Diethyl glycol Monomethyl Ether	3.6
Hydraulic Oil	0.2
Hydrogen peroxide (3%)	0.6
Isooctane (aka gasoline	< 0.1
Isopropyl Alcohol	2.6
Mineral oil (Light)	0.1
Mineral oil (Heavy)	0.1
Salt Water (3.5% NaCl)	0.6
Skydrol 5	0.5
Sodium Hydroxide solution (0.025% PH 10)	0.7
Strong Acid (HCl conc)	1.4
Water	0.7
Xylene	1.60